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Article: BGA/PCB interconnect design guidelines: a successful BGA design is the right combination of pad diameter, drill diameter, anti-pad and aspect ratio that maximizes the routing density.(BGA GUIDELINES)
- Article from:
- Printed Circuit Design & Manufacture
- Article date:
- September 1, 2007
- Author:
CopyrightCOPYRIGHT 2007 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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A BGA is a surface-mount package used for ICs. Solder balls are stuck to the bottom of the package, and the BGA is placed on a PCB that maintains copper pads in a pattern that matches the solder balls. The assembly is then heated in a reflow oven, causing the solder to melt, flow around the BGA footprint and align with the PCB.
The size and location of vias determine the trace and space, and the number of tracks per channel. Therefore, the key element to success of BGA/PCB interconnects or BGA escape/routing techniques is to determine the right combination of trace width and space, pad diameter, drill diameter, anti-pad diameter and aspect ratio. This allows the ...