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Article: ASE Selects Ultratech Advanced-Packaging Lithography System for Wafer-Level Packaging Expansion.
- Article from:
- PR Newswire
- Article date:
- October 30, 2007
CopyrightCOPYRIGHT 2007 PR Newswire Association LLC. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Follow on Order from the World's Largest Packaging Foundry Reaffirms Ultratech's Leadership Position for Redistribution Applications
SAN JOSE, Calif., Oct. 30 /PRNewswire-FirstCall/ -- Ultratech, Inc. , a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices, today announced that it has received an order from Advanced Semiconductor Engineering, Inc. (ASE) for its 300-mm, advanced-packaging lithography system. As part of ASE's expansion plans for wafer-level packaging (WLP) services, the company will employ Ultratech's lithography system at its wafer-level packaging (WLP) and redistribution process facility in ...