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Article: An alternative drying process for MSDs: components baked at 70[degrees]C for 24 hr. in a vacuum passed IPC and EIA testing.
- Article from:
- Circuits Assembly
- Article date:
- November 1, 2007
- Author:
CopyrightCOPYRIGHT 2007 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Ed.: The complete article is at circuitsassembly.com.
J-STD-033B places a costly baking burden on the assembler. To mitigate this, it permits "alternative drying processes" with the following note: "Table 4-1 is based on worst case molded leadframe SMD packages. Users may reduce the actual bake time if technically justified (e.g., absorption/desorption data, etc.)." For lack of a better term, these alternative drying processes "conform" to J-STD-033B.
In 1994, a major cellphone maker internally reported success in driving sufficient moisture from taped MSD packages to prevent delamination at solder reflow. (4) The company baked components at ...