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Article: FormFactor Unveils New Addition to Wire Bond Logic Probe Card Family to Lower IC Test Costs for Mobile and Consumer Applications.
- Article from:
- Business Wire
- Article date:
- December 4, 2007
CopyrightCOPYRIGHT 2007 Business Wire. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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LIVERMORE, Calif. -- FormFactor, Inc. (Nasdaq:FORM) today announced the latest addition to its TrueScale[TM] probe card family for wire bond system-on-chip (SoC) devices. Offering scalability down to 40 micron pad pitch, the TrueScale PP40 wafer probe card is designed to enable high-efficiency and high parallelism wafer probing on advanced wire bond logic and SoC devices.
As the functionality and complexity of wire bond logic devices continue to rise, the number of I/Os per device is increasing. With semiconductor dimensions continuing to shrink, more of these I/Os are being packed into a smaller area. By supporting pad pitches down to 40 microns, FormFactor's ...