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Article: Dongbu HiTek and SETi Co-Develop 1.3 Megapixel CMOS Image Sensor (CIS) Chip at 110-nanometer Node.
- Article from:
- Business Wire
- Article date:
- January 3, 2008
CopyrightCOPYRIGHT 2008 Business Wire. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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New CIS Chip Targets Major Mobile Handset Manufacturers; Volume Production to Begin as Early as Q1-2008
SEOUL, South Korea -- Dongbu HiTek today announced that it has completed development of a 1.3 megapixel CMOS image sensor (CIS) device at the 110nm node. Targeting major manufacturers of mobile handsets worldwide, the new CIS chip was developed in partnership with the company's SETi subsidiary, which specializes in CIS design. Volume production is scheduled to begin as early as the first quarter of 2008.
The new 110nm CIS chip announced today represents Dongbu HiTek's first joint product development with SETi, which became a majority-owned subsidiary ...
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Article: Dongbu HiTek and SETi Co-Develop 1.3 Megapixel CIS ...
Wireless News;
January 9, 2008 ;
627 words
... ... January 9, 2008-Dongbu HiTek and SETi Co ... 10meters.com Dongbu HiTek announced that ... megapixel CMOS image sensor (CIS) device ... share of all image sensor shipments while ... CIS devices. Dongbu HiTek disclosed that ...
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