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Article: Soldering atmosphere's impact on solder joint formation: a Flextronics-Vitronics study finds the delivery method's impact is minimal.(Wave Soldering)
- Article from:
- Circuits Assembly
- Article date:
- March 1, 2008
- Author:
CopyrightCOPYRIGHT 2008 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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The 2007 iNEMI Roadmap identifies an increase in the use of nitrogen in reflow and wave soldering processes because of the lower wetting forces of Pb-free solders. While flux chemistries are being developed and improved to promote wetting of Pb-free alloys, it will take many iterations and time to achieve the desired results. The iNEMI Roadmap emphasizes nitrogen consumption reductions through alternative low-volume distribution methods. In combination with advanced flux chemistries, this would yield the desired quality and reduce operation costs.
To provide clarity to this industry gap, Flextronics and Vitronics Soltec jointly investigated soldering atmosphere's ...