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Article: Core(TM) 2 Duo COM Express Module Targets 'Extreme Rugged' Apps.
- Article from:
- PR Newswire
- Article date:
- April 9, 2008
CopyrightCOPYRIGHT 2008 PR Newswire Association LLC. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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SAN JOSE, Calif., April 9, 2008 /PRNewswire/ -- Ampro Computers Inc., a leading supplier of board-level embedded computers, today announced availability of the industry's first "extreme rugged" computer-on-module (COM) based on Intel's Core2 Duo processor and GME965 chipset. The COM 840 integrates a single- or dual-core processor, RAM, graphics, networking, PCI Express expansion, and more in a 3.7 x 4.5-inch module that operates from -40 to +85 degrees Celsius.
"With its unique mix of high integration, performance, reliability, and ruggedness, Ampro's COM 840 truly leads the COM Express pack," said Ampro CTO Rick Lehrbaum. "We expect this exciting new module to ...
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