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Article: Impact of soldering atmosphere on solder joint formation: a Flextronics-Vitronics Soltec collaborative investigation into techniques for reducing nitrogen consumption.
- Article from:
- Circuits Assembly
- Article date:
- April 1, 2008
- Author:
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Copyright informationCOPYRIGHT 2008 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Soldering atmosphere influences final solder interconnect formation. Based on previous studies, SnPb and Pb-free solders perform differently under varying soldering atmospheres. (1,2,3,4,5,6) Pb-free pastes' significant reductive influence on wetting and spreading may mandate an inerted atmosphere. (7,8) The question becomes, To what extent should nitrogen be used, if at all? Nitrogen adds cost to the assembly process, the amount dependent on geography. (9) As a result, industry has shown wide interest in decreasing consumption.
This project identifies atmosphere's influence on Pb-free solder joint formation by controlling the [O.sub.2] ppm levels in the oven during ...
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