Article: Impact of soldering atmosphere on solder joint formation: a Flextronics-Vitronics Soltec collaborative investigation into techniques for reducing nitrogen consumption.

Soldering atmosphere influences final solder interconnect formation. Based on previous studies, SnPb and Pb-free solders perform differently under varying soldering atmospheres. (1,2,3,4,5,6) Pb-free pastes' significant reductive influence on wetting and spreading may mandate an inerted atmosphere. (7,8) The question becomes, To what extent should nitrogen be used, if at all? Nitrogen adds cost to the assembly process, the amount dependent on geography. (9) As a result, industry has shown wide interest in decreasing consumption.

This project identifies atmosphere's influence on Pb-free solder joint formation by controlling the [O.sub.2] ppm levels in the oven during ...

Related newspaper, magazine, and journal articles:

Newsweek Harper's Magazine The Washington Post Chicago Tribune Crain's Chicago Business PRNewswire Pediatric News The Nation Advertising Age The Economist (US) A FREE trial gives you access to over 80 million articles! Access over 6,500 publications with a FREE trial!