|
|
Article: Area array packaging--then and now.(Circuits Unusual)
- Article from:
- CircuiTree
- Article date:
- May 1, 2008
- Author:
CopyrightCOPYRIGHT 2008 BNP Media. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
|
High-volume packaging was presumably launched during WWII, when ceramic modules were mass-produced for proximity bomb fuses. Alumina ([Al.sub.2][O.sub.3]) was found to be a highly robust substrate and is still widely used today. The war-era packages used screen-printed conductors that were fixed by firing at higher temperatures than was required by the inorganic ceramic chemistry. Components, such as miniature vacuum tubes, were hand soldered. Some progress had been made with printing resistors; the mixed technology led to the term hybrid circuits and ceramic hybrid technology. The second-level connection from the module also required hand soldering using an insulated wire ...
Related newspaper, magazine, and journal articles:
|
|
Article: PCB inspection outlook for 2005: regardless of their labor rate, ...
EE-Evaluation Engineering;
December 1, 2004 ;
700+ words
... ... density results from the trend to use more area-array packages in each assembly. Boris Mathiszik ... assemblies may have contained one to five area-array packages, but now designs frequently ... assemblies has led to a greater use of area-array devices, which in turn, is dictating ...
|
|