Article: Ball grid array soldering: fine-pitch BGAs accommodate new design needs, but present daunting assembly problems.(Electronics)

Article: Texas, Illinois Inventors Develop Circuit Substrate Solder ...
US Fed News Service, Including US State News;  April 22, 2008 ;     502 words ...ALEXANDRIA, Va., April 22 -- William C. Weigler and Robert Babula, both of New Braunfels, Texas, James E. Herbold of Gonzales, Texas, Thomas P. Gall of Northbrook, Ill., and Steven G. Sharkey of Island Park, Ill., have developed printed circuit substrates. According to the U.S. Patent &

Article: Designing for wave solderability: board layout is the leading ...
Circuits Assembly;  April 1, 2007 ;     700+ words ...Component suppliers' suggested layouts, in general, assume that only the supplier's particular component is used. In the real world, this is seldom the case. Often then, even when using "recommended" layout rules, the result is poor soldering. For better outcomes, one must recognize the effect of

Article: Finding BGA opens in production: a new method using AXI ...
Circuits Assembly;  March 1, 2003 ;     700+ words ... ... entire assembly due to unavoidable damage to the PCB. BGA Solder Joints In all BGAs, a ball of solder is attached ... standoff from the board for increased strain relief. BGA Opens Some BGA solder defects are open solder joints. Finding open solder joints ...

Article: BGA is up to old anti-Democrat tricks
Chicago Sun-Times;  February 19, 1990 ;     700+ words ... ... pretending to be a civic watchdog group, the BGA has become a GOP dirty tricks factory. The BGA's cheap and tawdry tactics are more slanderous ... Cecil A. Partee is the latest victim of the BGA's dirty tricks. Last year, Partee charged ...

Article: BGA/PCB interconnect design guidelines: a successful ...
Printed Circuit Design & Manufacture;  September 1, 2007 ;     700+ words ...A BGA is a surface-mount package used for ICs ... stuck to the bottom of the package, and the BGA is placed on a PCB that maintains copper pads ... causing the solder to melt, flow around the BGA footprint and align with the PCB. The size ...

Article: Reducing BGA defects with AXI inspection: this study ...
Circuits Assembly;  July 1, 2005 ;     700+ words ... ... of BGAs and detection and measurement of BGA voids has become critical as use of BGAs on assemblies has increased. How large can a BGA void be and still be considered acceptable ... that we have an accurate method to measure BGA voids. Second, we must ensure that the ...

Article: Solving a BGA footprint mismatch: daughter card to the ...
Circuits Assembly;  February 1, 2003 ;     700+ words ... ... modification. When attaching ball grid array (BGA) components, what do you do when you discover ... discovering that they had loaded the wrong BGA onto the board. To further complicate matters, the footprint for the correct BGA was not the same as the original. The company ...