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Article: Unisem and FlipChip International Sign Licensing Agreement for Wafer Bumping and Wafer Level Packaging Technologies.
- Article from:
- Business Wire
- Article date:
- June 16, 2008
CopyrightCOPYRIGHT 2008 Business Wire. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Partnership With UAT Allows FCI to Extend Its Reach to the Asian Market
KUALA LUMPUR, Malaysia -- Unisem (M) Berhad (Unisem) and its subsidiary Unisem-Advanpack Technologies Sdn Bhd (UAT) announced today that they have entered into an agreement with FlipChip International, LLC (FCI) for the licensing of FCI's wafer bumping and wafer level packaging technologies. As part of the agreement, UAT will license FCI's core technologies, including its premier Spheron[TM] technology. FCI will further solidify its investment in the partnership by becoming a shareholder of UAT.
FCI's wafer bumping technology offers complete bumping solutions for fine pitch devices, ...