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Article: United States: Toppan Printing Enters into New Photomask Process Development Agreement with IBM.
- Article from:
- TendersInfo
- Article date:
- June 20, 2008
CopyrightCOPYRIGHT 2008 Al Bawaba (Middle East) Ltd. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Byline: kavita03
Toppan Printing Co., Ltd. (Toppan Printing; Head office: Chiyoda-ku, Tokyo; President & CEO: Naoki Adachi) today announced that it has entered into a new development agreement with IBM that covers the last phase of 32nm photomask process development, and all phases of 22nm photomask process development. This joint development will take place at IBM s Burlington photomask facility in Essex Junction, VT., starting in June 2008.
Photomasks are used to transfer semiconductor chip circuits onto a silicon wafer, and this photolithography process is a critical first step in semiconductor production. Semiconductors have become increasingly ...