|
|
Article: Japan: Toppan Printing signs photomask process development deal with IBM.
- Article from:
- TendersInfo
- Article date:
- June 25, 2008
CopyrightCOPYRIGHT 2008 Al Bawaba (Middle East) Ltd. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
|
Byline: mohammed05
Toppan Printing has entered into a new development agreement with IBM that covers the last phase of 32nm photomask process development, and all phases of 22nm photomask process development. This joint development will take place at IBM's Burlington photomask facility in Essex Junction, VT., starting this month 2008.
Photomasks are used to transfer semiconductor chip circuits onto a silicon wafer, and this photolithography process is a first step in semiconductor production. Toppan Printing and IBM started joint development of photomasks for 45nm semiconductors ...