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Article: "Package-on-package warpage-impact on surface mount yields and board level reliability".(Component Reliability)
- Article from:
- Circuits Assembly
- Article date:
- August 1, 2008
- Author:
CopyrightCOPYRIGHT 2008 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Abstract: This paper presents a systematic study performed to modulate the warpage of the top and bottom PoP, and to study the effect of the relative warpage of the top and bottom PoP on surface mount yields during PoP assembly. A 15 x 15 mm PoP module was selected as it magnifies the warpage effects. Shadow more was used for high temperature warpage measurement while ...
Related newspaper, magazine, and journal articles:
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Article: Surface mount connectors catch on. ...
Electronics Weekly;
February 24, 1993 ;
700+ words
...The market for surface mount connectors is growing at 46 assesses their ... costs has resulted in widespread use of surface mount technology (SMT) One area of SMT however, the surface mount connector, has only recently begun to gain ...
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