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Article: "Package-on-package warpage-impact on surface mount yields and board level reliability".(Component Reliability)
- Article from:
- Circuits Assembly
- Article date:
- August 1, 2008
- Author:
CopyrightCOPYRIGHT 2008 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Abstract: This paper presents a systematic study performed to modulate the warpage of the top and bottom PoP, and to study the effect of the relative warpage of the top and bottom PoP on surface mount yields during PoP assembly. A 15 x 15 mm PoP module was selected as it magnifies the warpage effects. Shadow more was used for high temperature warpage measurement while ...
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Article: An equivalent circuit for a microwave surface mount ...
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October 1, 1991 ;
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... ... Circuit for a Microwave Surface Mount Package An electrical equivalent ... developed for a microwave surface mount package. The self-consistent ... developed for a microwave surface mount package. These packages ...
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