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Article: Chemorheology of a highly filled epoxy compound.
- Article from:
- Polymer Engineering and Science
- Article date:
- August 1, 1996
- Author:
CopyrightCOPYRIGHT 1996 Society of Plastics Engineers, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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INTRODUCTION
The materials studied are epoxy compounds used for the encapsulation of Integrated Circuits via a transfer molding process. Highly filled epoxy resins satisfy encapsulation requirements and are, therefore, almost universally accepted. For mathematical modeling of the processing of reactive materials, one needs, apart from the reaction heat and the kinetics, an expression that relates viscosity to temperature, shear rate, and degree of reaction. Furthermore, the gel point, which states a no-flow condition, needs to be determined.
In the literature only limited information can be found concerning the effect of curing on viscosity especially for ...