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Article: Optimize Wafer Thickness for 450 mm.
- Article from:
- Semiconductor International
- Article date:
- December 1, 2008
CopyrightCOPYRIGHT 2008 Reed Business Information, Inc. (US). This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Tadashi Kanda, Toshiyuki Fujiwara and Kazushige Takaishi, SUMCO Corp., Tokyo, www.sumcosi.com
Wafer thickness significantly affects costs and yield in wafer and device manufacturing. To avoid the problems experienced at 300 mm, the optimum thickness for 450 mm must be targeted.
Making production-worthy 450 mm wafers includes the risk of dislocation loss, crystal defect control during a lengthy growth process, and development of appropriate crystal pullers and quartz crucibles, and degradation of wafer flatness. We have studied optimal wafer thickness for 450 mm wafers based on gravitational bending (sag), different support methods, vibrational effects and other ...