Article: Improving lead-free solder reliability: ENEPIG is a unique surface finish that exhibits improved solder joint reliability when it is used with lead-free SAC alloys.(FINAL FINISH FORUM)

Article: Adhesives can replace eutectic solder.(Assembly ...
Assembly;  August 1, 2003 ;     405 words ... ... has published the results of its 6-year project that evaluated electrically conductive adhesives as a substitute for eutectic solder for surface mount electronics assembly. The project resulted in the formulation of a new flexible conductive epoxy to address ...

Article: Aging Characteristics of Sn-Ag Eutectic Solder ...
Metallurgical and Materials Transactions;  October 1, 2009 ;     700+ words ... ... growth of intermetallics with the appearance pf Cu^sub 3^Sn. Formation of Cu^sub 3^Sn is pronounced for hypo and eutectic solder alloy with OSP surface finish on Cu substrate. In a different endeavor, Sn-Ag eutectic alloy with the varying amount ...

Article: Unitive Provides Multi-Level Thin Film Redistribution Wiring For ...
PR Newswire;  December 17, 2001 ;     700+ words ... ... product, the largest asynchronous crosspoint switch available for the optical networking industry. Unitive will also perform eutectic solder bumping for VSC3140's flip chip packaging integration. "Unitive is pleased to be working with Vitesse to help enhance ...

Article: A mixed technology reliability assessment: using a mix of lead ...
Circuits Assembly;  February 1, 2007 ;     700+ words ... ... and wave solder alloys. Solder paste printing and component placement followed similar conditions as those used for SnPb eutectic solder assemblies. The primary process differences between Pb-free and SnPb solder assemblies were in the reflow and wave solder ...

Article: The role of eutectics in solder joint appearance: a ...
Circuits Assembly;  November 1, 2006 ;     700+ words ... ... where traces of the lowest melting eutectic solder are found. If these traces are at ... formation of micro-cracks in the solder joint. During solidification, the eutectic ... during final solidification of the solder joint, a "soup" forms of molten solder ...

Article: Gold wire and solder joint microforce testing using ...
Experimental Techniques;  September 1, 2003 ;     700+ words ... ... properties of the gold wire.4-5 The solder joint mechanically attaches the component ... thermal continuity. The major cause of solder joint failure is low cycle fatigue due to ... prediction are the most important issues in solder joint reliability. It is very challenging ...

Article: Keeping solder joints whole: effects of bulk phosphorous content ...
CircuiTree;  September 1, 2004 ;     700+ words ... ... Systems The key variables for testing solder joint reliability were electroless nickel ... under standard operating parameters. Solder joint formation of ENIG surface finishes takes ... known that the formed IMC influences the solder joint integrity. A uniform and dense IMC ...