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Article: Bolder Technologies Corporation Receives Commitment for $8 Million Equipment Financing Credit Line;
- Article from:
- PR Newswire
- Article date:
- May 8, 1997
CopyrightCOPYRIGHT 1997 PR Newswire Association LLC. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Concurrently Withdraws Registration Statement for Equity Offering
DENVER, May 8 /PRNewswire/ -- BOLDER Technologies Corporation (Nasdaq-NNM: BOLD), developer and manufacturer of advanced, high power rechargeable batteries based on its patented Thin Metal Film (TMF (TM)) technology, today announced it has signed a commitment letter with Transamerica Business Credit Corporation to provide up to $8 million for the financing of BOLDER's first state-of-the-art, high volume manufacturing line.
This transaction increases BOLDER's credit line with Transamerica to $13 million. The Company previously announced that it had secured a credit line from ...