|
|
Article: Research from L.Z. Zhang and co-researchers in the area of components and packaging technology published.
- Article from:
- Electronics Newsweekly
- Article date:
- April 8, 2009
CopyrightCOPYRIGHT 2009 NewsRX. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
|
According to a study from the United States, "The current techniques for nondestructive quality evaluation of bumped solder joint connections in electronics packages are either incapable of detecting solder joint cracks, or unsuitable for inline inspection due to cost and throughput reasons. As an alternative, a novel solder joint inspection system is being developed."
"The system projects short laser pulses onto specimen surface through optic fibers to induce structural vibration. The induced surface displacements are then measured by a laser Doppler vibrometer. A number of digital signal processing algorithms, such as error ratio and correlation coefficient, ...