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Article: Rudolph Technologies and SEMATECH Extend Collaboration at UAlbany NanoCollege.
- Article from:
- Business Wire
- Article date:
- April 20, 2009
CopyrightCOPYRIGHT 2009 Business Wire. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Joint development research will focus on 3D TSV process control
ALBANY, N.Y. -- Rudolph Technologies, Inc. (NASDAQ: RTEC) and SEMATECH, the global consortium of leading chipmakers, announced today that Rudolph has joined SEMATECH's 3D Interconnect Program at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany. The joint partnership is a continuation of collaborative efforts in process characterization, with a new focus on 3D IC (three-dimensional integrated circuits) processing and enhancing process control of TSV (through-silicon vias) manufacturing. This is the second year that Rudolph will serve as a Member of SEMATECH.
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