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Article: NexLogic Technologies Doubles Production Capacity With New PCB Assembly Systems; Helps OEM Customers Achieve Time-to-Market, Time-to-Revenue Goals.
- Article from:
- PRWeb
- Article date:
- May 21, 2009
CopyrightCOPYRIGHT 2009 COMTEX News Network, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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San Jose, CA, May 21, 2009 (PRWeb.com via COMTEX) -- NexLogic Technologies, Inc. has announced the purchase and installation of new and highly advanced printed circuit boards (pcb) assembly equipment, allowing it to increase its pcb production capacity. The new equipment includes two pick and place systems, MyData Model MY15 and Fuji XPF and a Speedline Technologies Model MPM125 stencil printer.
Zulki Khan, president and founder of NexLogic Technologies, said, "With this new assembly equipment, we're responding to customers requests to increase our throughput and production capacity. At the same time, these acquisitions provide equipment redundancy to boost our ...