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Article: Apache Design Solutions to Demonstrate the Next Generation Power Integrity Solutions for IC Package and SiP Designs at ECTC 2009.
- Article from:
- Business Wire
- Article date:
- May 21, 2009
CopyrightCOPYRIGHT 2009 Business Wire. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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SAN JOSE, Calif. -- Apache Design Solutions, the technology leader in power and noise integrity for chip, package, and system convergence, today announced that they will be participating at the upcoming Electronics Components and Technology Conference (ECTC) in San Diego, California, May 17 - 28, 2009. ECTC is the premier international packaging, components, and microelectronic systems technology conference. Apache will be demonstrating Sentinel, a complete power and noise analysis platform for IC package, PCB, and SiP designs in booth #220. The Sentinel products address the challenges associated with system-level power integrity, I/O-SSO, thermal, and EMI issues.
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Article: Apache Design Solutions Closes 2008 with ...
Wireless News;
February 2, 2009 ;
367 words
...Wireless News 02-02-2009 Apache Design Solutions Closes 2008 with Record Sales Type: News Apache Design Solutions, a provider of power and noise analyses solutions ...
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