|
|
Article: Die-Attach Technology.
- Article from:
- Semiconductor International
- Article date:
- March 15, 2009
CopyrightCOPYRIGHT 2009 Reed Business Information, Inc. (US). This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
|
Staff
The Ablestik brand has added a self-filleting die attach that is a less-costly alternative to film-based materials. Employing traditional automatic-dispense technology, a dot of self-filleting material is deposited and the die gently placed. The capillary force of the material then draws it out to the edge of the die where it forms a small fillet. No excessive placement force is required, which ...
Related newspaper, magazine, and journal articles:
|
|
Article: 10 Gbps chip-on-board polymer optical fiber links.(POF 2008 ...
Plastic Optical Fiber Newsletter;
January 1, 2009 ;
650 words
... ... electric interface, and mechanical uncertainty introduced by the choice of low cost "pick-and-place" die attach technology. In this paper we present a refractive, hemi-aspheric, non-imaging optical concentrator that is compatible ...
|
|