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Article: Silicon Results Validate Design for E-Beam Methodology at the 65-nm Node.
- Article from:
- PR Newswire
- Article date:
- May 26, 2009
CopyrightCOPYRIGHT 2009 PR Newswire Association LLC. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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D2S, e-Shuttle and Fujitsu Microelectronics Collaborate On First Test Chip
SAN JOSE, Calif., May 26 /PRNewswire/ -- The eBeam Initiative, a forum dedicated to the education and promotion of a new design-to-manufacturing approach known as design for e-beam (DFEB), today announced that steering group members D2S, Inc., e-Shuttle, Inc. and Fujitsu Microelectronics Limited have validated the DFEB methodology for low-volume, 65-nm system-on-chip applications, without sacrificing performance, area or power. DFEB combines software and design technologies that enable today's most advanced character projection (CP) e-beam direct-write (EbDW) equipment to reduce shot ...