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Article: OPC Technology Introduces First Production-Capable IC Layout Correction Tool for Deep Submicron Processes.
- Article from:
- Business Wire
- Article date:
- February 9, 1998
CopyrightCOPYRIGHT 1998 Business Wire. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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SAN JOSE, Calif.--(BUSINESS WIRE)--Feb. 9, 1998--
SignaMask OPC's Model-Based Approach Provides Fast and
Highly Accurate Correction of Proximity Effects for Reliable
Mask Generation
OPC Technology, Inc. today introduced SignaMask OPC(TM), the electronic design automation (EDA) industry's first automated IC layout correction tool for production use on chip designs in deep submicron semiconductor process technologies. SignaMask OPC features an innovative, model-based approach incorporating new optical proximity correction (OPC) algorithms derived from research performed at U.C. Berkeley.
SignaMask OPC's optical and ...