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Article: EV GROUP WINS ORDER FROM RF COMPONENTS MAKER EPCOS.
- Article from:
- Electro Manufacturing
- Article date:
- July 1, 2009
CopyrightCOPYRIGHT 2009 Worldwide Videotex. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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EV Group (EVG), St. Florian, Austria, a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has announced that EPCOS - a leading electronic components, modules and systems manufacturer - selected EVG's fully automated GEMINI wafer bonder for high-volume RF components production at EPCOS's production facility based in Munich, Germany. EPCOS is utilizing EVG's wafer bonder to manufacture surface acoustic wave (SAW) filters embedded in RF devices for a variety of applications, including GPS navigation equipment, mobile phones and home entertainment systems.
"As we continue to innovate and further ...