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Article: Research by M. Noren and colleagues in surface mount technology provides new insights.
- Article from:
- Journal of Technology
- Article date:
- June 16, 2009
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According to recent research published in the journal Soldering & Surface Mount Technology, "One of the major driving forces for the electronic industry is the consumer handheld units, where even more functions in a smaller volume and with longer battery time are requested. This leads to a higher energy- and interconnect-density."
"Two challenges related to this request, that the industry is facing, are thermal management and reliability. This paper aim to discuss some aspects of using flip chip (FC) technology on low temperature cofired ceramics (LTCC) for this kind of products and to focus on the heat dissipation problem of an FC mounted die. ...