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Article: Data on packaging technology discussed by E.A. Chow and colleagues.
- Article from:
- Journal of Engineering
- Article date:
- July 15, 2009
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"Micro-springs for integrated circuit test and packaging are demonstrated as soldered flip chip interconnects in a direct die to printed circuit board package. The spring interconnects are fabricated with thin film metallization as the last step in a wafer-scale process," scientists writing in the journal IEEE Transactions on Advanced Packaging report.
"The z-compliance of the interconnects can be used to test and/or burn-in parts in wafer form. After the parts are diced from the wafer, the springs then become the first-level (and often the last-level) interconnect between the chip and the board. The xy-compliance of the interconnect enables considerably large ...