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Article: SUSS MicroTec and Thin Materials Cooperate on Temporary Bonding Solution for 3D Packaging.
- Article from:
- Electronics Newsweekly
- Article date:
- July 22, 2009
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SUSS MicroTec (FWB:SMH)(GER:SMH), one of the leading suppliers of process and test solutions for microstructuring applications in semiconductor and related markets, and Thin Materials, a semiconductor process development company, announced that they are cooperating on a temporary bonding solution to be used for challenging thin wafer handling technologies required for emerging 3D Integration and Packaging technologies. With this cooperation SUSS MicroTec extends its solution portfolio for temporary bonding and thin wafer handling.
The temporary bond material of Thin Materials is capable of handling wafer processing temperatures in excess of 250°C while being ...