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Article: NEXX Systems and SEMATECH to Collaborate on 3D Interconnect Research at UAlbany NanoCollege.
- Article from:
- Nanotechnology Business Journal
- Article date:
- February 9, 2009
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SEMATECH, a global consortium of chip-makers, and NEXX Systems, Inc., a leading provider of process equipment for advanced wafer-level packaging applications, announced that NEXX Systems has become a member of SEMATECH's 3D Interconnect Program located at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany.
As a member of SEMATECH's 3D program, NEXX will collaborate with SEMATECH in leading-edge research on innovative electrodeposition technology and the development of high yield, low cost copper electroplating solutions that will enable high density 3D through-silicon-vias (TSVs).
Dr. Tom Walsh, NEXX Systems, President ...