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Article: United States : BeSang Demonstrates Multi-Layer 3D IC Technology.
- Article from:
- TendersInfo
- Article date:
- August 5, 2009
CopyrightCOPYRIGHT 2009 Al Bawaba (Middle East) Ltd. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Byline: shiv03
BeSang Inc., a fabless semiconductor company based in Beaverton, OR, has successfully developed a multi-layer stacked three-dimensional (3D) integrated circuit (IC) technology. This 3D IC technology enables ultra low-cost solid-state drives (SSD), semiconductor memories, image sensors, and high-performance logic products with large embedded memory blocks.
This 3D IC technology includes four single-crystalline silicon layers having 200 nm to 60 nm feature size vertical device structures which are uniquely processed at low temperatures, below 400 degree Celsius. The four single-crystalline silicon layers are formed above a silicon substrate ...
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Article: India: BeSang enables first 3D IC.
TendersInfo;
August 16, 2008 ;
700+ words
... ... different layers of the same 3D chip, BeSang's process packs in more die per ... translates into lower costs per die. "BeSang was founded five years ago to work on 3D IC technology," said Sang-Yun Lee, BeSang's founder and CEO. BeSang "has ...
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