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Article: United kingdom : Intersil Signs MOU with Tower Semiconductor for Co-Development and Manufacturing of Next-Generation Power Management Platform.
- Article from:
- TendersInfo
- Article date:
- August 14, 2009
CopyrightCOPYRIGHT 2009 Al Bawaba (Middle East) Ltd. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Byline: shiv03
Intersil Corporation a world leader in the design and manufacture of high-performance analog and mixed-signal semiconductors, and Tower Semiconductor, Ltd. (Nasdaq: TSEM)(TASE: TSEM), a leading global specialty foundry, announced they will work together to develop a new high-performance power management specialty process technology platform. A Memorandum of Understanding (MOU) has been signed by the companies which shall be followed by a formal agreement. The multi-year agreement will combine Tower s technology expertise with Intersil s design and process technology capabilities to provide Intersil with a powerful and innovative platform, ...