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Article: Intersil Signs MOU with Tower Semiconductor for Co-Development and Manufacturing of Next-Generation Power Management Platform.
- Article from:
- Electronics Newsweekly
- Article date:
- August 26, 2009
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Intersil Corporation (NASDAQ Global Select: ISIL), a world leader in the design and manufacture of high-performance analog and mixed-signal semiconductors, and Tower Semiconductor, Ltd. (Nasdaq: TSEM)(TASE: TSEM), a leading global specialty foundry, announced they will work together to develop a new high-performance power management specialty process technology platform. A Memorandum of Understanding (MOU) has been signed by the companies which shall be followed by a formal agreement.
The multi-year agreement will combine Tower's technology expertise with Intersil's design and process technology capabilities to provide Intersil with a powerful and innovative ...