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Article: The backend will feel the bumps: for many package subcontractors, the road to recovery won't be smooth.(On the Forefront)
- Article from:
- Circuits Assembly
- Article date:
- August 1, 2009
- Author:
CopyrightCOPYRIGHT 2009 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Semiconductor industry analysts argue that the worst is behind us. In the second quarter, wafer shipment growth is tracking at over 50% quarter-over-quarter at TSMC, UMC, SMIC and Chartered. ASE, Amkor and SPIL reported positive revenue growth during the period, and are optimistic about the third quarter. Yet, while each quarter may be better than the last, the road to recovery for the backend equipment OEMs and material suppliers may be a bit bumpy.
Advanced packages, comprised of ball grid arrays and chip-scale packages, are the source of much of the unit and revenue growth in the semiconductor packaging and assembly sector. While BGA and CSP shipments will ...