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Article: EV Group's GEMINI Wafer Bonder Selected by Leading Korean Research Center and Foundry Service Provider RFID/USN for 3D MEMS Manufacturing.
- Article from:
- PR Newswire
- Article date:
- September 29, 2009
CopyrightCOPYRIGHT 2009 PR Newswire Association LLC. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Company Witnesses Positive Momentum in the Korean MEMS Market
ST. FLORIAN, Austria, Sept. 29 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that the RFID/USN Center has selected EVG's fully automated GEMINIA' wafer bonding system for stacked 3D MEMS device development. Located in Incheon, Korea, RFID/USN is a leading MEMS foundry that offers manufacturing services for companies to initiate production processes with capabilities to segue from R&D to high volume. This order represents a significant win for EVG, marking its first foray into the ...