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Article: Decapsulating ICs: opening the package reveals the potential defects within.(TECH TIPS)
- Article from:
- Circuits Assembly
- Article date:
- September 1, 2009
CopyrightCOPYRIGHT 2009 UP Media Group, Inc. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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DECAPSULATION, OR DE-CAP, is a failure analysis technique that involves removal of material packaging from an integrated circuit. After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy with energy dispersive x-ray spectroscopy can identify the composition of any anomalies present after de-cap under higher magnification.
Removing package material can be performed either mechanically or chemically, depending on the IC design. With ceramic packaging, de-cap usually is done mechanically by chiseling off the top with a fine razor and small ...