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Article: Technologies, Applications and Markets of WLP 2009.
- Article from:
- M2 Presswire
- Article date:
- October 1, 2009
CopyrightCOPYRIGHT 2009 Normans Media Ltd. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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M2 PRESSWIRE-1 October 2009-Bharat Book Bureau: Technologies, Applications and Markets of WLP 2009(C)1994-2009 M2 COMMUNICATIONS
RDATE:01102009
Wafer Level Packaging is a confirmed high growth trend in the semiconductor packaging industry. Wafer Level Chip Scale Packaging (WLCSP), or the direct bonding on printed circuit boards (PCB's) of bumped integrated circuits (IC's) as one of the most visible expressions of WLP, is undoubtedly the fastest growing package type in the whole industry. Yole forecasts that it will exceed 10 billion units per year by 2012, at a compound annual growth rate of more than 20% over the next 5 years. ...