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Article: Research from R.W. Zhang et al broadens understanding of components and packaging technology.
- Article from:
- Nanotechnology Weekly
- Article date:
- October 5, 2009
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According to a study from the United States, "We have investigated the electrical properties of anisotropic conductive adhesive (ACA) joint using submicrometer-sized (similar to 500 nm in diameter) silver (Ag) particle as conductive filler with the effect of pi-conjugated self-assembled molecular wires."
"The ACAs with submicrometer-sized Ag particles have higher current carrying capability (similar to 3400 mA) than those with micro-sized Au-coated polymer particles (similar to 2000 mA) and Ag nanoparticles (similar to 2500 mA). More importantly, by construction of pi-conjugated self-assembled molecular wire junctions between conductive particles and integrated ...