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Article: EV Group Installs Fusion Wafer Bonding Systems at Two Leading CMOS Image Sensor Manufacturing Facilities in Asia.
- Article from:
- PR Newswire
- Article date:
- October 6, 2009
CopyrightCOPYRIGHT 2009 PR Newswire Association LLC. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Company Reinforces Leadership in Wafer-Level 3D Integration
DRESDEN, Germany, Oct. 6 /PRNewswire/ -- SEMICON Europa 2009 -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has completed the installation of two automated fusion bonding systems for 300-mm wafers at a leading semiconductor foundry and at a major consumer electronics manufacturer. The GEMINIA' FB automated production fusion bonding systems will be employed for the production of backside illuminated CMOS image sensors ranging from ultra-compact wafer-level cameras for mobile phones to larger ...
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Article: EV Group wins Austrian Innovation Award 2004.
Business Wire;
March 11, 2005 ;
609 words
...SCHARDING, Austria -- EV Group, which has more wafer bonders in production ... prestigious national prize recognizes EV Group's technology leadership in producing ... processors - SOI production bonder." EV Group competed for the national award with ...
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