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Article: Rudolph Technologies Receives Multiple System Order from ASE for its Complete Portfolio of Back-End Inspection Solutions.
- Article from:
- Business Wire
- Article date:
- October 8, 2009
CopyrightCOPYRIGHT 2009 Business Wire. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Rudolph sees significant market potential as leading manufacturers implement data analysis capability in their 2D and 3D in-line inspection for advanced packaging processes.
FLANDERS, N.J. -- Rudolph Technologies, Inc. (NASDAQ: RTEC), a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, announced today that it has received an order for multiple back-end inspection tools from Advanced Semiconductor Engineering, Inc. (ASE, TAIEX: 2311) (NYSE: ASX), the world's largest semiconductor packaging and test company. This purchase for automated NSX([R]) Inspection Systems with Discover([R]) yield management software ...