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Article: Tower and Jazz Semiconductor Announce Deep-Silicon-Via™ Technology for Cellular and WiFi SiGe Power Amplifiers and Front-End Modules.
- Article from:
- Electronics Newsweekly
- Article date:
- October 14, 2009
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Tower Semiconductor Ltd. (NASDAQ: TSEM) (TASE: TSEM) and its U.S. subsidiary, Jazz Semiconductor, announced the availability of its proprietary Deep-Silicon-Via™ (DSV) technology available in its 0.18-micron SiGe BiCMOS (SBC18). The new offering provides a simpler, more innovative way to create a low-inductance ground required to reduce power consumption of power amplifiers (PAs). Unlike older Through Wafer Vias used primarily with smaller wafer sizes in GaAs-based technology, the DSV is optimized for silicon 8-inch wafer manufacturing to significantly reduce the cost of the PA.
The DSV technology developed by Jazz utilizes existing equipment in its silicon ...