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Article: ITRI and Applied Materials Collaborate to Advance 3D IC Technology.
- Article from:
- Business Wire
- Article date:
- October 15, 2009
CopyrightCOPYRIGHT 2009 Business Wire. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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TAIPEI, Taiwan -- Taiwan's Industrial Technology Research Institute (ITRI) and Applied Materials, Inc. announced today a collaboration to accelerate the development and commercialization of 3D* chip stacking technology. To enable this important effort, a full line of processing systems from Applied Materials has been selected by ITRI for its 3D laboratory in Hsinchu, Taiwan. These state-of-the-art systems will be used for fabricating through-silicon vias (TSVs), a key technique for making compact, energy-efficient, high performance CMOS image sensors, and stacked memory and memory/logic chips for mobile communications devices.
Applied and ITRI intend to work ...