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Article: American Semiconductor Announces Multi-Project Wafers for 180nm Flexfet CMOS.
- Article from:
- Electronics Newsweekly
- Article date:
- November 4, 2009
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American Semiconductor, Inc. announces a Multi-Project Wafer (MPW) program for 180nm Flexfet CMOS process. This program provides access to Flexfet CMOS for ultra low power and radiation hardened electronics, enabling low cost proof-of-concept and prototype silicon on an advanced CMOS process.
"Our MPW program will enable wider access to Flexfet Multiple Independent Gate FET (MIGFET) CMOS technology," said Doug Hackler, President and CEO of American Semiconductor. "Flexfet is similar in concept to FinFET in that both technologies have two controlled gates. Flexfet has a planar architecture with independently controlled gates that enables a commercially viable ...