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Article: Alchimer Quantifies Payoff of High-Aspect-Ratio TSVs: Move from 5:1 to 20:1 Can Save Over $700/Wafer by Reducing Space Needs.
- Article from:
- Business Wire
- Article date:
- November 3, 2009
CopyrightCOPYRIGHT 2009 Business Wire. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Cost Efficiency from Smaller TSV Footprint Significantly Expands Economic Advantages of AquiVia's Low Cost of Ownership for 3D Devices
MASSY, France -- Alchimer S.A., leading provider of technology for the deposition of nanometric films used in both semiconductor interconnects and 3D through-silicon vias (TSV), has demonstrated that TSVs with aspect ratios of 20:1 can save chipmakers more than $700 per 300-mm wafer compared to TSVs with ratios of 5:1, by reducing the die area needed for interconnection.
Alchimer modeled TSV costs and space consumption using an existing 3D processor stack for mobile applications that includes a low-power microprocessor, ...