|
|
Article: Samsung Develops Advanced Packaging Technology to Achieve a 0.6mm-thick 8-chip Package.
- Article from:
- Business Wire
- Article date:
- November 4, 2009
CopyrightCOPYRIGHT 2009 Business Wire. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
|
Ultra-Thin Memory Stacks for High-Density Consumer Electronics
SEOUL, South Korea -- Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, announced today that it has developed the world's thinnest multi-die package, one that measures a mere 0.6mm in height. Designed initially for 32 gigabyte (GB) densities, the new memory package is just half the thickness of a conventional memory package of eight stacked chips (or dies). The advanced packaging technology delivers a 40 percent thinner and lighter memory solution for high-density multimedia handsets and other mobile devices.
"Thin remains the action word in ...