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Article: MICRON INTRODUCES NAND AND LOW-POWER DRAM MULTI-CHIP PACKAGES.
- Article from:
- AsiaPulse News
- Article date:
- November 5, 2009
CopyrightCOPYRIGHT 2009 Asia Pulse Pty Ltd. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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(Full text of a statement. Contact details below.)
(BW)(ID-MICRON-TECHNOLOGY)(MU.NYSE) Micron Introduces New NAND and Low-Power DRAM Multi-Chip Packages Built on the Industry's Most Advanced Processes
Announcement Highlights Leveraging its latest process technology for NAND and DRAM, Micron introduces the industry's most advanced multi-chip packages (MCP) for smart phones, personal media players, and mobile Internet devices (MIDs) Micron's packaged monolithic 4 gigabit (Gb) NAND and 2Gb low-power DDR (LPDDR) die provide improved cost, power and system optimization
Technology Writers
BOISE, Idaho--(BUSINESS WIRE) - Nov. 03, 2009-- ...
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