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Article: New data from M.K. Abdullah et al illuminate research in plastics and composites.
- Article from:
- Chemicals & Chemistry
- Article date:
- November 13, 2009
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"The numerical and experimental investigations of three-dimensional (3-D) mold filling during encapsulation process in stacked-chip scale package (S-CSP) are presented. The finite difference method (FDM) based on Navier-Stokes equations has been employed for the flow analysis in the mold cavity," investigators in Nibong Tebal, Malaysia report.
"The mold flow is assumed to be non-Newtonian and non-isothermal. The proposed models can take care of polymer rheology with cure effect (Castro-Macosko model) and without cure effect (Cross model). A package with five, six, and seven overhang stacking dies without wire bonds is considered for simulation. The epoxy molding ...