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Article: Integrated Circuit Advanced Packaging Industry Report - 2009 Edition.(Report)
- Article from:
- China Weekly News
- Article date:
- November 10, 2009
CopyrightCOPYRIGHT 2009 NewsRX. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Research and Markets (http://www.researchandmarkets.com/research/43f0ee/ic_advanced_packag) has announced the addition of the "IC Advanced Packaging Industry Report, 2009" report to their offering.
The semiconductor industry is in the era of 32nm process, and it is expected that it will meet 16nm around 2019. Designing a 45nm SoC costs USD20-50 million except labor cost, and the design of a 32nm SoC costs USD75-120 million, while it is less than USD5 million for 130nm. Therefore, even if the IC design companies with annual revenue of over USD2 billion probably can not afford such high cost, and there are no more than ten such companies all over the world, which ...