Article: Tessera to Present at International Symposium on Microelectronics.

Tessera Technologies, Inc. (Nasdaq:TSRA) will participate in a series of panels and technical sessions at the International Symposium on Microelectronics (IMAPS) in San Jose, Calif.: WHAT:

Advanced Materials Panel

Panel Co-Chair: Y. Zhang, senior engineer, R&D, Tessera

November 3rd @ 8:00 a.m.

Design for Reliability Panel

Paper: Design and Reliability of PILR™ Package-on-Package (PoP)

Panel Co-Chair and Presenter: I. Mohammed, director of Packaging Development, Tessera

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