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Article: Dow Electronic Materials Introduces New Metallization and Imaging Products for Printed Circuit Boards.(Company overview)
- Article from:
- Leisure & Travel Business
- Article date:
- November 15, 2009
CopyrightCOPYRIGHT 2009 NewsRX. This material is published under license from the publisher through the Gale Group, Farmington Hills, Michigan. All inquiries regarding rights should be directed to the Gale Group. (Hide copyright information)
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Dow Electronic Materials introduced its new line of metallization and imaging products for printed circuit boards (PCB) at the recent TPCA show and IMPACT Conference. These advanced materials provide high-performance, cost effective solutions with improved environmental profiles for the PCB industry, and address the demand for smaller, more sustainable, less expensive and better performing consumer electronics. PCB Electrolytic Plating - MICROFILL™ EVF Via Fill provides greatly enhanced via filling at exceptionally low surface thicknesses and is capable of simultaneous through-hole plating. It is suitable for both HDI and IC (Integrated Circuit) Substrate ...